PART |
Description |
Maker |
MT49H32M9 MT49H8M36 MT49H16M18 |
288Mb CIO Reduced Latency
|
Micron Technology, Inc.
|
MT49H8M36 MT49H16M18 MT49H32M9 |
288Mb CIO Reduced Latency
|
MICRON[Micron Technology]
|
Z8036 Z8536 |
CAP POLYPROPYLENE .0015UF 50V 1% Z-CIO AND CIO COUNTER/TIMER AND PARALLEL I/O UNIT
|
ZiLOG, Inc.
|
CY7C1550KV18-450BZC CY7C1550KV18-400BZC CY7C1548KV |
Sync SRAM; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 2M X 36 DDR SRAM, 0.45 ns, PBGA165 72-Mbit DDR II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
|
Cypress Semiconductor, Corp.
|
SI4392DY SI4392DY06 |
N-Channel Reduced Qg, Fast Switching WFET? N-Channel Reduced Qg, Fast Switching WFET庐 N-Channel Reduced Qg, Fast Switching WFET㈢
|
Vishay Siliconix
|
LTC2420I LTC2420IS8 LTC2420 LTC2420CS8 2420I LTC24 |
20-Bit uPower No Latency ADC in SO-8 24bit uPower No Latency ADC From old datasheet system
|
LINER[Linear Technology]
|
K4C89183AF-GIFB K4C89083AF-ACF5 K4C89083AF-ACF6 K4 |
288Mb x18 Network-DRAM2 Specification
|
SAMSUNG[Samsung semiconductor]
|
GS81332QT19CE-250M GS81332QT19CE-350M GS81332QT37C |
Rad-Hard SRAM 288Mb/144Mb/72Mb Burst of 2 SigmaQuad-II 1.8 Rad-Hard SRAM 288Mb/144Mb/72Mb Burst of 2 SigmaQuad-II TM
|
GSI Technology
|
IS61DDB22M18-250M3 IS61DDB22M18 IS61DDB21M36-250M3 |
36 Mb (1M x 36 & 2M x 18) DDR-II (Burst of 2) CIO Synchronous SRAMs
|
Integrated Silicon Solution, Inc
|
K7K3236T2C K7K3218T2C |
1Mx36 & 2Mx18 DDRII CIO b2 SRAM
|
Samsung semiconductor
|
K7K1636T2C K7K1618T2C |
512Kx36 & 1Mx18 DDRII CIO b2 SRAM
|
Samsung semiconductor
|